AVGO Climbs 2.2% as Jalapeño AI Chip Targets 1GW Data Centers by 2026

For markets, the partnership signals a potential re-rating of Broadcom as a leading AI infrastructure play. With gigawatt-scale deployments slated to begin late 2026, the collaboration could generate billions in custom chip revenue, directly competing with Nvidia’s GPU franchise and altering the semiconductor investment thesis.

On June 24, 2026, OpenAI and Broadcom unveiled Jalapeño, OpenAI's first custom AI inference chip designed explicitly for large-language model (LLM) inference. This marks a pivotal moment in the AI infrastructure landscape, as the lab seeks to decouple from the general-purpose GPU paradigm that has defined the AI acceleration market to date. The chip was delivered to OpenAI's leadership after a blistering nine-month design-to-tape-out cycle, a timeline that defies industry norms and signals the rising maturity of the custom ASIC ecosystem backed by companies like Broadcom. According to the joint press release, early lab tests demonstrate the chip running ML workloads at production target frequency and power with 'substantially better' performance per watt than current state-of-the-art solutions. This efficiency is attributed to a 'blank-slate design' — the architecture was built from the ground up for modern LLM inference, not adapted from earlier accelerator generations. By reducing data movement and balancing compute, memory, and networking resources, Jalapeño achieves utilization closer to theoretical peak performance, potentially translating to significant cost savings at scale.

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On June 24, 2026, OpenAI and Broadcom unveiled Jalapeño, OpenAI's first custom AI inference chip designed explicitly for large-language model (LLM) inference.

The deployment ambition is equally monumental. Broadcom stated the platform will be deployed at gigawatt-scale data centers with Microsoft and other partners beginning by the end of 2026, with multiple chip generations planned. This signals that OpenAI is not merely experimenting with custom silicon, but building a proprietary compute backbone capable of supporting the next decade of AI. For Broadcom, the collaboration underscores its growing role in custom ASIC design, having previously worked with companies like Google on TPUs. The integration of its Tomahawk networking silicon further cements its position as an end-to-end data center infrastructure provider. The scale of deployment is unprecedented for a first-generation custom chip, implying a high level of confidence from both partners in yields and performance.